中国姓交大比赛图片:翻译专业文章

X-23-7783D
Thermal Interface Material
Description of Use
Thermal grease (X-23-7783D) is a thermal interface material developed by Shin-Etsu
Chemical Co., Ltd. to meet the current and future thermal management requirements of
high performance microprocessors. It is used to increase heat sink effectiveness by
closing the air gap existing between the top of the processor and the fan heat sink. Air is
a thermal insulator with a thermal conductivity of 0.027W/mK. The grease is applied to the
raised area on top of the processor after the processor is in the socket. The fan heat sink
is centered on the processor top, with the raised areas on the bottom of the heat sink and
the processor top aligned. The fan heat sink is firmly pressed to evenly distribute the
thermal grease until the metal of the heat sink is felt against the metal of the processor top.
The excess grease can be removed by wiping with a soft cloth.
Typical Physical Properties
Appearance Gray
Viscosity (25C) 1500 Poise
Bulk Thermal Conductivity
More than 4 W/mK (with solvent)
More than 6 W/mK
(w/o solvent, as X-23-7783)
Volatile Content (150C x 24hrs) 2.5%
Handling instruction
1. Suggest to store the material under 10 deg C. Once open the lid, please use it
up as soon as possible.
2. Require stirring the material up before using.
3. X-23-7783D contains 2wt% of solvent as a diluted component for application of
screen-printing. Therefore, require removing solvent after putting 7783D on
substrate. Recommendable curing condition: 60 deg C x 30min