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Thermal Properties for Cured Epoxy Resins
TGA is the most favored technique for rapid evaluation in comparing and ranking the thermal stability of various polymers. Themogravimetric analyses of both DOPO and Bis-A epoxy resins cured with various curing agents of Ph Nov, DDS, and DICY in nitrogen and air are shown in Table II. The results indicated that DOPO epoxy resin cured with Ph Nov, DDS, and DICY have higher char yield than that of cured Bis-A epoxy resin. TGA thermograms of cured Bis-A epoxy/Ph Nov and DOPO epoxy/Ph Nov in a nitrogen atmosphere are illustrated in Figure 4. Bis-A /Ph Nov exhibited 1% weight loss at 257°C and then a rapid weight loss at 442°C. On the other hand, DOPO epoxy resin showed its 1% weight loss at 207°C, and a 10% weight loss at around 367°C. DOPO epoxy exhibited a lower first step rapid weight loss temperature (at 376°C) than that of Bis-A epoxy resin (at 442°C). However, unlike the one- stage weight loss behavior of the Bis-A epoxy/ Ph Nov system, the DOPO epoxy/Ph Nov showed a second-stage weight loss at around 521°C. This phenomenon indicates an important role in improving the flame retardancy of the resins. While the resin is burning, the phosphorus- containing groups first decompose at around 376°C, and then form a phosphorus-rich residue that prevents further decomposition of the epoxy resin by raising the second decomposition temperature to 521°C and results in a high char yield. The char yields at 700°C for the Bis-A epoxy/Ph Nov system and DOPO epoxy/Ph Nov system were 19 and 48%. TGA thermograms of DOPO and Bis-A epoxy resins cured with various curing agents are shown in Table II.

用软件译吧,太长了,又专业..